China supplier, high purity metals, sputtering targets, alloy targets, metal powders, metal oxides.
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Purity：3N5 4N
Shape：Plane target / Rotating target
Specification：1Kg
Appearance: a dark (blue-grey) metal
Melting point: 3017°C
Density: 16.6g/cm 3
Specification: D32x1.75mm, D76.2x3.175mm or customised
Properties: high conductivity, high thermal stability
Packing: three-layer vacuum packaging or argon protection, in line with IATA, DOT packaging specifications
Applications:
1. Tantalum sputtering targets are used in microelectronic applications such as thermal ink jet print-heads, copper plating and silicon through-hole technology.
2. Since high temperature inks can cause cavitation in some ink-jet printers, Tantalum sputtering targets can be used as anti-cavitation films to protect ink facilities.
3. Some Tantalum sputtering targets are also used in glass coating.