In general, sputtering target mainly consists of target blanks, backing plates and other parts of the composition, in which the target blank is a high-speed ion beam stream bombardment of the target material, belonging to the core part of the sputtering target, in the sputtering coating process, target blanks by the ion impact, the surface of the atom sputtering dispersed and deposited on the substrate made of electronic film.

According to the type can be divided into:

Metal sputtering targets

Alloy sputtering target

Oxide sputtering targets

Evaporation materials

According to the application field can be divided into: 

    Semiconductor chip target

    Flat display target

    Solar cell target

    Information storage target

    Tool modification target

    Electronic device target and other targets